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碳化硅功率器件及应用 / 功率模块封装及可靠性-IFWS系列

F1-碳化硅功率器件与封装应用论坛

时间:2021年12月6日 13:30-18:00

地点:深圳会展中心•六层茉莉厅

Time: Dec 6th,2021,13:30-18:10

Location: Shenzhen Convention and Exhibition Center • 6th Floor Jasmine Hall

协办支持/Co-organizer:

芜湖启迪半导体有限公司 WuHu Advanced Semiconductor Manufacturing Co.,Ltd

中国电子科技集团公司第四十八研究所 The 48th ResearchinstituteofElectronics Technology Group Corporation

北京北方华创微电子装备有限公司 Beijing NAURA Microelectronics Equipment Co., Ltd.

德国爱思强股份有限公司AIXTRON SE

上海瞻芯电子科技有限公司InventChip Technology Co., Ltd.

屏幕尺寸 / Slides Size:16:9

主持人

Moderator

盛 况——浙江大学电气工程学院院长、教授

SHENG Kuang——Dean and Professor, School of Electrical Engineering, Zhejiang University

张清纯——复旦大学特聘教授、上海碳化硅功率器件工程技术研究中心主任

Jon Zhang---Distinguished Professor of Fudan University

邱宇峰——国家电网全球能源互联网研究院原院长、厦门大学讲座教授

QIU Yufeng, Former Dean of Global Energy Interconnection Research Institute and Chair Professor of Xiamen University

13:30-13:50

碳化硅大规模商业化:现状与障碍SiC Mass Commercialization: Present Status and Barriers

Victor VELIADIS——Chief Officer and CTO of Power America, Professor of North Carolina State University

Victor VELIADIS——美国电力首席执行官兼首席技术官、北卡罗莱纳州立大学教授

13:50-14:10

SiC器件和模块的最新进展

RecentAdvancesofSiCPower Devices

张清纯——复旦大学特聘教授、上海碳化硅功率器件工程技术研究中心主任

Jon Zhang--Distinguished Professor of Fudan University

14:10-14:30

SiC器件在新能源汽车产业中的应用

Application of SiC devices in the new energy automobile industry

吴壬华——深圳欣锐科技股份有限公司董事长

WURenhua—Chairof the Board, SHINRY

14:30-14:50

碳化硅芯片会在 2025-2030 年被电动汽车广泛采用的可能性探讨The Question: Will SiC chips be widely adopted by Electric Vehicles in 2025-2030?

Anant AGARWAL—美国俄亥俄州立大学教授、IEEE会士

Anant AGARWAL—Professorof The Ohio State University, IEEE Fellow

14:50-15:10

SiC功率器件制造工艺特点与核心装备创新进展

Manufacturing process characteristics and key equipment development of SiC power devices

巩小亮——中国电子科技集团公司第四十八研究所 半导体装备研究部副主任

GONGXiaoliang— Deputy director of Semiconductor equipment research department, the 48th Research Institute of China Electronics Technology Group Corporation

15:10-15:30

SiC MOS器件氧化后退火新途径——低温再氧化退火技术A new approach of post-oxidation annealing for SiC MOS devices -- the low-temperature re-oxidation annealing technology

王德君——大连理工大学教授

Wang Dejun——Professor of Dalian University of Technology

15:30-15:50

化合物半导体工艺设备解决方案 Equipment and Processes Solutions in Compound Semiconductor

王显刚——北京北方华创微电子装备有限公司LED及化合物半导体行业发展部总经理

WANGXiangang——General Manager ofLED and Compound Semiconductor Developmentdepartment, Beijing NAURA Microelectronics Equipment Co.,ltd.

15:50-16:10

SiC 功率MOSFET器件的可靠性研究

Development trends and challenges of SiC Power MOSFET device

张艺蒙——西安电子科技大学微电子学院教授

Yimeng Zhang—— Professor of School of Microelectronics, Xidian University

16:10-16:30

第三代半导体碳化硅器件产业化关键技术及发展进展The key technology and development progress of the Wide Band-gap semiconductor silicon carbide device industrialization

钮应喜——芜湖启迪半导体有限公司研发总监

NIU Yingxi——R&D Director of Wuhu Advanced Semiconductor Manufacturing Co.,ltd

16:30-16:50

促进宽禁带半导体产业化的关键外延技术The key epitaxial technology to promote the industrialization of wide bandgap semiconductors

方子文——德国爱思强股份有限公司中国区副总经理

FANG Ziwen——Deputy General Manage,China AIXTRON SE

16:50-17:10

先进封装大板扇出研发及功率器件封装应用

The Research on Panel Level Fan Out Package and its Application on Power Electronics

林挺宇——广东佛智芯微电子技术研究有限公司副总经理,广东省半导体智能装备与系统集成创新中心首席科学家

Tingyu LIN—Deputy General Manager of Guangdong FZX Microelectronics Technology Co. Ltd, Principal Scientist of CNC Equipment Cooperative Innovation Institute

17:10-17:30

高可靠功率系统集成的发展和挑战

Development and Challenge of High-Reliability Power System in Packaging

侯峰泽—中国科学院微电子研究所系统封装与集成研发中心副研究员

HOU Fengze —Associate Professor、 Packaging and Integration Research and Development Center, Institute of Microelectronics of Chinese Academy of Sciences

17:30-17:45

基于P区反序掺杂策略的高效碳化硅结势垒肖特基二极管的研究

High-Efficiency 1200 V/ 20 A 4H-SiC JBS Diodes with Better FOM Based on Charge-Balance Strategy

张园览——复旦大学

Yuan-Lan ZHANG—Fudan University

17:45-18:00

压装式IGBT双面热阻测试方法的研究与应用Research and Application of Double-sided Thermal Resistance Test Method for Press-pack IGBT

张祎慧——全球能源互联网研究院高级工程师

ZHANG Yihui—Global Energy Interconnection Research Institute